Specification
- PRODUCTINFORMATION
Size: 182*60*24mm
Weight: 370g
- New design of glue removal slot, larger, more stable, and easier to use
- Add functional combination areas, chip storage slots, iPhone CPU de-gluing area, and multi-functional chip fixing area
- Deepen V-shaped groove dislocation fixed angle, reasonable avoidance, tight clamping
- High temperature resistant synthetic stone panel, anti-static, anti-corrosion
- Chip heat dissipation design, suitable for multi-functional clamping such as motherboard welding/chip glue removal/board moving repair, etc
- High-temperature resistance/Precise positioning/Misplaced buckle/Clamp firmly
- Suitable for all kinds of traditional/special-shaped motherboards, multiple misaligned buckles make the clamping and fixing more stable and firm, and not easy to deform
- Support different maintenance needs, suitable for motherboard welding/chip glue removal/board moving repair/camera repair and clamping
- Independent slide design, universal mobile phone repair clamp, using slide rail fixation design to meet the needs of motherboards of different shapes
Recensioni
Ancora non ci sono recensioni.